SURFACE MOUNT CAPABILITIES 

  • Paste Printers with 2.5D Inspection and Programmable Stencil Cleaning
  • Universal & Juki Pick and Place Equipment
  • Vision system and laser inspection for all types of components
  • Convection Reflow ovens
  • Dual Reflow
  • Intrusive Reflow or Pin-in-Paste technology
  • Use of SPC, FAI, and First Pass Yield Trends Charts
  • BGA, uBGA, 0201, fine pitch, 01005 capable
  • Double sided SMT
  • Leaded or lead-free (RoHS compliant)

THROUGH-HOLE & BOX BUILD CAPABILITIES 

  • No-Clean Technology
  • Ionic Contamination control to BellCore and MIL standards
  • Universal Axial Insertion and Radial Insertion Equipment
  • Vitronics Wave Soldering Equipment
  • Selective De-bridging knives on wave soldering
  • Use of Selective wave soldering techniques
  • Cellular Manufacturing / Lean Manufacturing
  • Use of SPC, FAI, and First Pass Yield Trends Charts
  • Leaded or lead-free (RoHS compliant)

Mixed Technology PCB